Part Details for QP27C64-12/ZA by Teledyne e2v
Overview of QP27C64-12/ZA by Teledyne e2v
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for QP27C64-12/ZA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
QP27C64-12/ZA
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Avnet Americas | PROM, UV ERASABLE, 8K X 8, 120 NS ACCESS - Rail/Tube (Alt: QP27C64-12/ZA) Min Qty: 250 Package Multiple: 1 Container: Tube | 0 |
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RFQ |
Part Details for QP27C64-12/ZA
QP27C64-12/ZA CAD Models
QP27C64-12/ZA Part Data Attributes
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QP27C64-12/ZA
Teledyne e2v
Buy Now
Datasheet
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Compare Parts:
QP27C64-12/ZA
Teledyne e2v
UVPROM, 8KX8, 350ns, CMOS, CQCC32, CERAMIC, LCC-32
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | QFJ | |
| Package Description | CERAMIC, LCC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 350 ns | |
| Additional Feature | 100 YEAR DATA RETENTION | |
| JESD-30 Code | R-CQCC-N32 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Supply Current-Max | 0.065 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD |
Alternate Parts for QP27C64-12/ZA
This table gives cross-reference parts and alternative options found for QP27C64-12/ZA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QP27C64-12/ZA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 8510204ZX | UVPROM, CMOS, CQCC32, | Teledyne e2v | QP27C64-12/ZA vs 8510204ZX |
| 8510206ZX | UVPROM, CMOS, CQCC32, | Teledyne e2v | QP27C64-12/ZA vs 8510206ZX |
| MBM27C64-20CV | UVPROM, 8KX8, 200ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | QP27C64-12/ZA vs MBM27C64-20CV |
| MBM2764-20 | 8KX8 UVPROM, 200ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | QP27C64-12/ZA vs MBM2764-20 |
| QP27C64-25/ZA | UVPROM, 8KX8, 350ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | QP27C64-12/ZA vs QP27C64-25/ZA |
| QP27C64-15/ZA | UVPROM, 8KX8, 350ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | QP27C64-12/ZA vs QP27C64-15/ZA |
| QP27C64-35/ZA | UVPROM, 8KX8, 350ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | QP27C64-12/ZA vs QP27C64-35/ZA |
| 8510203ZX | UVPROM, 8KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Intel Corporation | QP27C64-12/ZA vs 8510203ZX |