There are no models available for this part yet.
Overview of QP27C256-90/UA by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for QP27C256-90/UA by Teledyne e2v
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
QP27C256-90/UA
|
Avnet Americas | PROM, UV ERASABLE, 32K X 8, 90 NS ACCESS - Rail/Tube (Alt: QP27C256-90/UA) Min Qty: 250 Package Multiple: 1 Container: Tube | 0 |
|
RFQ |
CAD Models for QP27C256-90/UA by Teledyne e2v
Part Data Attributes for QP27C256-90/UA by Teledyne e2v
|
|
|
|---|---|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
TELEDYNE E2V (UK) LTD
|
|
Part Package Code
|
QFJ
|
|
Package Description
|
CERAMIC, LCC-32
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
90 ns
|
|
JESD-30 Code
|
R-CQCC-N32
|
|
Memory Density
|
262144 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
32KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
QCCN
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
CHIP CARRIER
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
MIL-STD-883 Class B
|
|
Supply Current-Max
|
0.025 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Position
|
QUAD
|
Alternate Parts for QP27C256-90/UA
This table gives cross-reference parts and alternative options found for QP27C256-90/UA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QP27C256-90/UA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606307YC | UVPROM, 32KX8, 90ns, CMOS, CQCC32, | Teledyne e2v | QP27C256-90/UA vs 5962-8606307YC |
| 5962-8606307YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32 | QP Semiconductor | QP27C256-90/UA vs 5962-8606307YX |
| AT27HC256R-90LM/883 | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | QP27C256-90/UA vs AT27HC256R-90LM/883 |
| 5962-8606307YA | UVPROM, 32KX8, 90ns, CMOS, CQCC32 | QP Semiconductor | QP27C256-90/UA vs 5962-8606307YA |
| 5962-8606307YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32, | Teledyne e2v | QP27C256-90/UA vs 5962-8606307YX |
| AM27C256-95LCB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | QP27C256-90/UA vs AM27C256-95LCB |
| 27C256-90E/K | 32K X 8 UVPROM, 90 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | QP27C256-90/UA vs 27C256-90E/K |
| 27HC256-90I/K | 32K X 8 UVPROM, 90 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | QP27C256-90/UA vs 27HC256-90I/K |
| AM27C256-95LIB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | QP27C256-90/UA vs AM27C256-95LIB |
| 5962-8606307YC | UVPROM, 32KX8, 90ns, CMOS, CQCC32, | Waferscale Integration Inc | QP27C256-90/UA vs 5962-8606307YC |