Datasheets
QP27C256-35/YA by: Teledyne e2v

UVPROM, 32KX8, 35ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Part Details for QP27C256-35/YA by Teledyne e2v

Overview of QP27C256-35/YA by Teledyne e2v

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for QP27C256-35/YA

Part # Distributor Description Stock Price Buy
DISTI # QP27C256-35/YA
Avnet Americas PROM, UV ERASABLE, 32K X 8, 35 NS ACCESS - Rail/Tube (Alt: QP27C256-35/YA) Min Qty: 250 Package Multiple: 1 Container: Tube 0
RFQ

Part Details for QP27C256-35/YA

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QP27C256-35/YA Part Data Attributes

QP27C256-35/YA Teledyne e2v
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QP27C256-35/YA Teledyne e2v UVPROM, 32KX8, 35ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 35 ns
JESD-30 Code R-GDIP-T28
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for QP27C256-35/YA

This table gives cross-reference parts and alternative options found for QP27C256-35/YA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QP27C256-35/YA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606321QXX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8606321QXX
QP7C271-35WMB UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, WINDOWED, DIP-28 Teledyne e2v QP27C256-35/YA vs QP7C271-35WMB
5962-8981706UX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor QP27C256-35/YA vs 5962-8981706UX
5962-8606321QUA UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8606321QUA
5962-8606321QXX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor QP27C256-35/YA vs 5962-8606321QXX
5962-8981706UX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8981706UX
CY7C279-35WC UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C279-35WC
CY27H256-35WI UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY27H256-35WI
CY7C274-35WI UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C274-35WI
WS57C256F-35T UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 Waferscale Integration Inc QP27C256-35/YA vs WS57C256F-35T
Part Number Description Manufacturer Compare
5962-8606321QXX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Cypress Semiconductor QP27C256-35/YA vs 5962-8606321QXX
5962-8981706UX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8981706UX
CY7C274-35WI UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C274-35WI
CY7C279-35WI UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C279-35WI
CY7C271A-35WI UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C271A-35WI
CY7C279-35WC UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor QP27C256-35/YA vs CY7C279-35WC
5962-8606321QUA UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8606321QUA
5962-8606321QXX UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v QP27C256-35/YA vs 5962-8606321QXX
QP7C271-35WMB UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, WINDOWED, DIP-28 Teledyne e2v QP27C256-35/YA vs QP7C271-35WMB

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