There are no models available for this part yet.
Overview of PXAS33KBBD by Philips Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for PXAS33KBBD by Philips Semiconductors
Part Data Attributes for PXAS33KBBD by Philips Semiconductors
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
PHILIPS SEMICONDUCTORS
|
Package Description
|
QFP, QFP80,.55SQ,20
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Bit Size
|
16
|
CPU Family
|
XA
|
JESD-30 Code
|
S-PQFP-G80
|
JESD-609 Code
|
e0
|
Number of Terminals
|
80
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Equivalence Code
|
QFP80,.55SQ,20
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
1024
|
ROM (words)
|
16384
|
ROM Programmability
|
MROM
|
Speed
|
30 MHz
|
Supply Current-Max
|
80 mA
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
QUAD
|