Datasheets
PTN5100DBSBZ by: NXP Semiconductors

PTN5100DBS - USB Type-C PD PHY and protocol IC, SPI for dongles

Part Details for PTN5100DBSBZ by NXP Semiconductors

Results Overview of PTN5100DBSBZ by NXP Semiconductors

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Consumer Electronics Space Technology Internet of Things (IoT) Aerospace and Defense Smart Cities Energy and Power Systems Renewable Energy

PTN5100DBSBZ Information

PTN5100DBSBZ by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for PTN5100DBSBZ

Part # Distributor Description Stock Price Buy
DISTI # PTN5100DBSBZ
EBV Elektronik USB TypeC Power Delivery PHY and Protocol IC 20Pin HVQFN TR (Alt: PTN5100DBSBZ) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 27 Weeks, 0 Days EBV - 0
Buy Now

Part Details for PTN5100DBSBZ

PTN5100DBSBZ CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

PTN5100DBSBZ Part Data Attributes

PTN5100DBSBZ NXP Semiconductors
Buy Now Datasheet
Compare Parts:
PTN5100DBSBZ NXP Semiconductors PTN5100DBS - USB Type-C PD PHY and protocol IC, SPI for dongles
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HVQFN-20
Manufacturer Package Code SOT917-4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP

PTN5100DBSBZ Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a via-stitching technique to connect the ground plane to the power plane.

  • Implement thermal management by providing adequate heat sinking, using a thermal pad or heat sink, and ensuring good airflow around the device. Also, consider derating the device's performance at high temperatures according to the datasheet.

  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and implement proper filtering and shielding on the PCB. Also, ensure that the device is properly grounded and decoupled.

  • Use the device's low-power modes, optimize the clock frequency, and reduce the voltage supply when possible. Also, consider using a power management IC to regulate the power supply and minimize standby power consumption.

  • Use a logic analyzer, oscilloscope, and signal generator to debug and validate the device's operation. Also, consider using a protocol analyzer for specific protocols like USB or Ethernet.