Findchips: ptn3700ev/g,118 details by NXP Semiconductors

Results Overview of PTN3700EV/G,118 by NXP Semiconductors

Distributor Offerings: (6 listings)

Number of FFF Equivalents: (0 replacements)

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Part Data Attributes: (Available)

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Part #	Distributor	Description	Stock	Price	Buy
PTN3700EV/G,118 DISTI # 55921291	Verical	Mobile Pixel Link 56-Pin VFBGA T/R RoHS: Compliant Min Qty: 58 Package Multiple: 1 Date Code: 2052	Americas - 687	58 $0.7620 100 $0.7500 200 $0.7010	$0.7010 / $0.7620	Buy Now
PTN3700EV/G,118	Quest Components	CONSUMER CIRCUIT, PBGA56	1032	1 $3.0152 431 $1.2438 805 $1.1307	$1.1307 / $3.0152	Buy Now
PTN3700EV/G,118	Rochester Electronics	PTN3700 - IC MOBILE INTERFACE 56-VFBGA RoHS: Compliant Status: Obsolete Min Qty: 1	8	1 $0.9258 25 $0.9073 100 $0.8703 500 $0.8332 1,000 $0.7869	$0.7869 / $0.9258	Buy Now
PTN3700EV/G,118 DISTI # PTN3700EV/G,118	Avnet Silica	Mobile Interface Link Bridge IC 56Pin VFBGA TR (Alt: PTN3700EV/G,118) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000	Silica - 0			Buy Now
PTN3700EV/G,118 DISTI # C1S537100526072	Chip One Stop	1.8 V simple mobile interface link bridge IC RoHS: Compliant pbFree: Yes Container: Cut Tape	687	1 $0.7990 10 $0.7870 50 $0.7620 100 $0.7500 200 $0.7010	$0.7010 / $0.7990	Buy Now
PTN3700EV/G,118 DISTI # PTN3700EV/G,118	EBV Elektronik	Mobile Interface Link Bridge IC 56Pin VFBGA TR (Alt: PTN3700EV/G,118) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000	EBV - 0			Buy Now

Part Details for PTN3700EV/G,118

Show differences only	PTN3700EV/G,118 NXP Semiconductors Buy Now Datasheet	Buy Now	Compare Parts: PTN3700EV/G,118 NXP Semiconductors PTN3700 - 1.8 V simple mobile interface link bridge IC BGA 56-Pin Select a part to compare:

Rohs Code	Yes
Part Life Cycle Code	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS
Part Package Code	BGA
Package Description	4 X 4.50 MM, 0.65 MM HEIGHT, LEAD FREE, PLASTIC, SOT991-1, VFBGA-56
Pin Count	56
Manufacturer Package Code	SOT991-1
Reach Compliance Code	compliant
HTS Code	8542.39.00.01
Samacsys Manufacturer	NXP
Consumer IC Type	CONSUMER CIRCUIT
JESD-30 Code	R-PBGA-B56
Length	4.5 mm
Moisture Sensitivity Level	1
Number of Functions	1
Number of Terminals	56
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY
Package Code	VFBGA
Package Shape	RECTANGULAR
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260
Qualification Status	Not Qualified
Seated Height-Max	1 mm
Supply Voltage-Max (Vsup)	1.95 V
Supply Voltage-Min (Vsup)	1.65 V
Surface Mount	YES
Temperature Grade	INDUSTRIAL
Terminal Form	BALL
Terminal Pitch	0.5 mm
Terminal Position	BOTTOM
Width	4 mm

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and adjust the system design accordingly.
Monitor the input voltage, output voltage, output current, and junction temperature (TJ). Ensure the device operates within the recommended specifications to prevent overheating, overvoltage, or overcurrent conditions.
Use the shutdown pin to disable the device when not in use. Ensure the input voltage is within the recommended range, and consider using a low-dropout linear regulator or a switching regulator with a low quiescent current.
Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for the input and output. Ensure the capacitors are placed close to the device and have a low equivalent series resistance (ESR) for optimal performance.