Datasheets
PTN3700EV/G,118 by: NXP Semiconductors

PTN3700 - 1.8 V simple mobile interface link bridge IC BGA 56-Pin

Part Details for PTN3700EV/G,118 by NXP Semiconductors

Results Overview of PTN3700EV/G,118 by NXP Semiconductors

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Price & Stock for PTN3700EV/G,118

Part # Distributor Description Stock Price Buy
DISTI # 55921291
Verical Mobile Pixel Link 56-Pin VFBGA T/R RoHS: Compliant Min Qty: 58 Package Multiple: 1 Date Code: 2052 Americas - 687
  • 58 $0.7620
  • 100 $0.7500
  • 200 $0.7010
$0.7010 / $0.7620 Buy Now
Quest Components CONSUMER CIRCUIT, PBGA56 1032
  • 1 $3.0152
  • 431 $1.2438
  • 805 $1.1307
$1.1307 / $3.0152 Buy Now
Rochester Electronics PTN3700 - IC MOBILE INTERFACE 56-VFBGA RoHS: Compliant Status: Obsolete Min Qty: 1 8
  • 1 $0.9258
  • 25 $0.9073
  • 100 $0.8703
  • 500 $0.8332
  • 1,000 $0.7869
$0.7869 / $0.9258 Buy Now
DISTI # PTN3700EV/G,118
Avnet Silica Mobile Interface Link Bridge IC 56Pin VFBGA TR (Alt: PTN3700EV/G,118) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Silica - 0
Buy Now
DISTI # C1S537100526072
Chip One Stop 1.8 V simple mobile interface link bridge IC RoHS: Compliant pbFree: Yes Container: Cut Tape 687
  • 1 $0.7990
  • 10 $0.7870
  • 50 $0.7620
  • 100 $0.7500
  • 200 $0.7010
$0.7010 / $0.7990 Buy Now
DISTI # PTN3700EV/G,118
EBV Elektronik Mobile Interface Link Bridge IC 56Pin VFBGA TR (Alt: PTN3700EV/G,118) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 EBV - 0
Buy Now

Part Details for PTN3700EV/G,118

PTN3700EV/G,118 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

PTN3700EV/G,118 Part Data Attributes

PTN3700EV/G,118 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
PTN3700EV/G,118 NXP Semiconductors PTN3700 - 1.8 V simple mobile interface link bridge IC BGA 56-Pin
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 4 X 4.50 MM, 0.65 MM HEIGHT, LEAD FREE, PLASTIC, SOT991-1, VFBGA-56
Pin Count 56
Manufacturer Package Code SOT991-1
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Consumer IC Type CONSUMER CIRCUIT
JESD-30 Code R-PBGA-B56
Length 4.5 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 56
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.65 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Width 4 mm

PTN3700EV/G,118 Frequently Asked Questions (FAQ)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.

  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and adjust the system design accordingly.

  • Monitor the input voltage, output voltage, output current, and junction temperature (TJ). Ensure the device operates within the recommended specifications to prevent overheating, overvoltage, or overcurrent conditions.

  • Use the shutdown pin to disable the device when not in use. Ensure the input voltage is within the recommended range, and consider using a low-dropout linear regulator or a switching regulator with a low quiescent current.

  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for the input and output. Ensure the capacitors are placed close to the device and have a low equivalent series resistance (ESR) for optimal performance.