Datasheets
PTN3460IBS/F1Z by: NXP Semiconductors

PTN3460I - eDP to LVDS bridge for industrial and embedded applications QFN 56-Pin

Part Details for PTN3460IBS/F1Z by NXP Semiconductors

Results Overview of PTN3460IBS/F1Z by NXP Semiconductors

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Applications Consumer Electronics

Price & Stock for PTN3460IBS/F1Z

Part # Distributor Description Stock Price Buy
DISTI # PTN3460IBS/F1Z
Avnet Silica (Alt: PTN3460IBS/F1Z) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 27 Weeks, 0 Days Silica - 0
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DISTI # PTN3460IBS/F1Z
EBV Elektronik (Alt: PTN3460IBS/F1Z) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 27 Weeks, 0 Days EBV - 0
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Part Details for PTN3460IBS/F1Z

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PTN3460IBS/F1Z Part Data Attributes

PTN3460IBS/F1Z NXP Semiconductors
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PTN3460IBS/F1Z NXP Semiconductors PTN3460I - eDP to LVDS bridge for industrial and embedded applications QFN 56-Pin
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Package Description 7 X 7 MM, 0.85 MM HEIGHT, 0.40 MM PITCH, PLASTIC, MO-220, SOT949-2, HVQFN-56
Pin Count 56
Manufacturer Package Code SOT949-2
Reach Compliance Code unknown
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.0 TO 3.6
Consumer IC Type CONSUMER CIRCUIT
JESD-30 Code S-PQCC-N56
Length 7 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 56
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC56,.27SQ,16
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position QUAD
Width 7 mm

PTN3460IBS/F1Z Related Parts

PTN3460IBS/F1Z Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and use a common mode filter to reduce EMI.

  • Use a high-quality, low-ESR capacitor (e.g., 10uF, 6.3V) for power decoupling, and place it as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range (3.3V to 5.5V).

  • The maximum cable length depends on the specific application and cable type. As a general guideline, the PTN3460IBS/F1Z supports cable lengths up to 3 meters for USB 2.0 and 1 meter for USB 3.2 Gen 1.

  • Configure the device using the I2C interface to enable Alt Mode. Set the CC pin to the desired configuration (e.g., USB, DisplayPort, or Power Delivery). Refer to the datasheet and application notes for specific register settings and configuration details.

  • The device has a thermal pad on the bottom side. Ensure good thermal contact between the thermal pad and the PCB or a heat sink. Keep the device away from heat sources and ensure good airflow around the device.