Part Details for PNX1301EH,557 by NXP Semiconductors
Overview of PNX1301EH,557 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PNX1301EH,557
PNX1301EH,557 CAD Models
PNX1301EH,557 Part Data Attributes:
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PNX1301EH,557
NXP Semiconductors
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Datasheet
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PNX1301EH,557
NXP Semiconductors
IC, SOT553-1 Package, Standard Marking, Tray Dry Pack,Bakeable,Multiple
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | S-PBGA-B292 | |
| Number of Terminals | 292 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA292,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM |