Part Details for PM8056B-FEI by Microchip Technology Inc
Results Overview of PM8056B-FEI by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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PM8056B-FEI Information
PM8056B-FEI by Microchip Technology Inc is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for PM8056B-FEI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
95AC1996
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Newark | Afm-700 Supercap Kit, 1408 Bfbga 31X31X2.83Mm Tray Rohs Compliant: Yes |Microchip PM8056B-FEI RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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DISTI #
PM8056B-FEI
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Microchip Technology Inc | SXP 68x12G, BFBGA, Projected EOL: 2044-01-23 COO: South Korea, Taiwan ECCN: EAR99 RoHS: Compliant Lead time: 16 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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Buy Now | |
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DISTI #
PM8056B-FEI
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Avnet Silica | 68Port SAS Expander that features T10 zoning (Alt: PM8056B-FEI) RoHS: Compliant Min Qty: 27 Package Multiple: 27 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Win Source Electronics | Afm-700 Supercap Kit, 1408 Bfbga 31X31X2.83Mm Tray Rohs Compliant: Yes | 216 |
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$230.2095 / $256.7715 | Buy Now |
Part Details for PM8056B-FEI
PM8056B-FEI CAD Models
PM8056B-FEI Part Data Attributes
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PM8056B-FEI
Microchip Technology Inc
Buy Now
Datasheet
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PM8056B-FEI
Microchip Technology Inc
SXP 68x12G
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | BFBGA-1408 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Date Of Intro | 2020-12-14 | |
| Samacsys Manufacturer | Microchip | |
| JESD-30 Code | S-PBGA-B1408 | |
| Length | 31 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 1408 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Width | 31 mm |
PM8056B-FEI Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
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Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor the device's junction temperature and adjust the system design accordingly.
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Use a multi-layer PCB with a solid ground plane, decouple power supplies, and add EMI filters. Ensure that the device is placed in a shielded enclosure and follow proper cable routing and termination practices.
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Implement power-saving modes, reduce clock frequencies, and optimize the system's power management strategy. Use the device's built-in power-saving features, such as dynamic voltage and frequency scaling.
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The internal oscillator frequency should be set to 12 MHz or 24 MHz, depending on the application's requirements. Ensure that the oscillator is properly configured and calibrated for optimal performance.