Part Details for PL130-58SC-R by Microchip Technology Inc
Overview of PL130-58SC-R by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DF7058SCBPAKV | Renesas Electronics Corporation | 32-bit Microcontrollers | |
| DF7058SCFAKV | Renesas Electronics Corporation | 32-bit Microcontrollers |
Part Details for PL130-58SC-R
PL130-58SC-R CAD Models
PL130-58SC-R Part Data Attributes
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PL130-58SC-R
Microchip Technology Inc
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PL130-58SC-R
Microchip Technology Inc
Logic Circuit
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICREL INC | |
| Package Description | SOP, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IT ALSO OPERATES AT 3.3V | |
| Family | PL130 | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 4.875 mm | |
| Logic IC Type | LOGIC CIRCUIT | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.73 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 3.9 mm |