Datasheets
PC755BVGHU350LE by:

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

Part Details for PC755BVGHU350LE by Atmel Corporation

Overview of PC755BVGHU350LE by Atmel Corporation

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BVGHU350LE

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PC755BVGHU350LE Part Data Attributes

PC755BVGHU350LE Atmel Corporation
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PC755BVGHU350LE Atmel Corporation RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.24 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BVGHU350LE

This table gives cross-reference parts and alternative options found for PC755BVGHU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BVGHU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755BVG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BVGHU350LE vs PC755BVG350LE
PC755BVZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, FCBGA-360 Teledyne e2v PC755BVGHU350LE vs PC755BVZF350LE
PCX755BMGS350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755BVGHU350LE vs PCX755BMGS350LE
PC755BVGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BVGHU350LE vs PC755BVGH350LE
XPC755BPX350LB RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 Motorola Semiconductor Products PC755BVGHU350LE vs XPC755BPX350LB
XPC755BRX350LB 32-BIT, 350MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BVGHU350LE vs XPC755BRX350LB
PCX755BMGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PC755BVGHU350LE vs PCX755BMGU350LE
PCX755BMGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC755BVGHU350LE vs PCX755BMGHU350LE
PCX755BVGS350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 Teledyne e2v PC755BVGHU350LE vs PCX755BVGS350LE
PC755BMG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 Teledyne e2v PC755BVGHU350LE vs PC755BMG350LE
Part Number Description Manufacturer Compare
PC7410MGH450NE RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC755BVGHU350LE vs PC7410MGH450NE
MPC750ARX233LX 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PC755BVGHU350LE vs MPC750ARX233LX
MC7448VU867NC 32-BIT, 867MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor PC755BVGHU350LE vs MC7448VU867NC
TSPC750AMG8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BVGHU350LE vs TSPC750AMG8LH
PC7447MGU1100NB RISC Microprocessor, 32-Bit, 1100MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC755BVGHU350LE vs PC7447MGU1100NB
PPC7448HX1000NC 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BVGHU350LE vs PPC7448HX1000NC
TSXC750AVGSB/Q10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group PC755BVGHU350LE vs TSXC750AVGSB/Q10LH
PC755VGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BVGHU350LE vs PC755VGSU300LE
XPC750PRX366RE IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC Freescale Semiconductor PC755BVGHU350LE vs XPC750PRX366RE
PPC7447RX1267LB 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BVGHU350LE vs PPC7447RX1267LB

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