Datasheets
PC28F320J3D75B by:

Flash, 2MX16, 75ns, PBGA64

Part Details for PC28F320J3D75B by Micron Technology Inc

Overview of PC28F320J3D75B by Micron Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for PC28F320J3D75B

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PC28F320J3D75B Part Data Attributes

PC28F320J3D75B Micron Technology Inc
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PC28F320J3D75B Micron Technology Inc Flash, 2MX16, 75ns, PBGA64
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description BGA, BGA64,8X8,40
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 75 ns
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code S-PBGA-B64
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 16
Number of Sectors/Size 32
Number of Terminals 64
Number of Words 2097152 words
Number of Words Code 2000000
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA64,8X8,40
Package Shape SQUARE
Package Style GRID ARRAY
Page Size 4/8 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00012 A
Supply Current-Max 0.08 mA
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit NO
Type NOR TYPE

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