Part Details for PC28F256P30TFE by Micron Technology Inc
Overview of PC28F256P30TFE by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for PC28F256P30TFE
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip-Germany GmbH | RoHS: Not Compliant | 30 |
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RFQ | |
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Win Source Electronics | NOR Flash Parallel 1.8V 256M-bit 16M x 16 100ns 64-Pin EZBGA Tray / IC FLASH 256MBIT 100NS 64EASYBGA | 2233 |
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$11.1429 / $14.3928 | Buy Now |
Part Details for PC28F256P30TFE
PC28F256P30TFE CAD Models
PC28F256P30TFE Part Data Attributes
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PC28F256P30TFE
Micron Technology Inc
Buy Now
Datasheet
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Compare Parts:
PC28F256P30TFE
Micron Technology Inc
Flash, 16MX16, 100ns, PBGA64, ROHS COMPLIANT, BGA-64
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | ROHS COMPLIANT, BGA-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Micron | |
| Access Time-Max | 100 ns | |
| Boot Block | TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B64 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 4,255 | |
| Number of Terminals | 64 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 1.8 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Sector Size | 16K,64K | |
| Standby Current-Max | 0.00021 A | |
| Supply Current-Max | 0.031 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | NO | |
| Type | NOR TYPE | |
| Width | 10 mm |
Alternate Parts for PC28F256P30TFE
This table gives cross-reference parts and alternative options found for PC28F256P30TFE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC28F256P30TFE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| RC28F256P30TFE | Flash, 16MX16, 100ns, PBGA64, BGA-64 | Micron Technology Inc | PC28F256P30TFE vs RC28F256P30TFE |
| RC28F256P30TFB | Flash, 16MX16, 100ns, PBGA64, BGA-64 | Micron Technology Inc | PC28F256P30TFE vs RC28F256P30TFB |
| RC28F256P30TFA | Flash, 16MX16, 100ns, PBGA64, BGA-64 | Micron Technology Inc | PC28F256P30TFE vs RC28F256P30TFA |