Part Details for PC28F128J3D75D by Micron Technology Inc
Overview of PC28F128J3D75D by Micron Technology Inc
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Part Details for PC28F128J3D75D
PC28F128J3D75D CAD Models
PC28F128J3D75D Part Data Attributes:
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PC28F128J3D75D
Micron Technology Inc
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PC28F128J3D75D
Micron Technology Inc
Flash, 8MX16, 75ns, PBGA64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | BGA, BGA64,8X8,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 75 ns | |
| Alternate Memory Width | 8 | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | S-PBGA-B64 | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Sectors/Size | 128 | |
| Number of Terminals | 64 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA64,8X8,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Page Size | 4/8 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 128K | |
| Standby Current-Max | 0.00012 A | |
| Supply Current-Max | 0.08 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | NO | |
| Type | NOR TYPE |