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Memory / Flash Memories / PC28F00AP30TFA
Datasheets
PC28F00AP30TFA by: Micron Technology Inc

Flash, 64MX16, 100ns, PBGA64, BGA-64

Part Details for PC28F00AP30TFA by Micron Technology Inc

Results Overview of PC28F00AP30TFA by Micron Technology Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

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PC28F00AP30TFA Information

PC28F00AP30TFA by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for PC28F00AP30TFA

Part # Distributor Description Stock Price Buy
Quest Components FLASH, 64MX16, 100NS, PBGA64 1
  • 1 $15.6000
$15.6000 Buy Now
DISTI # PC28F00AP30TFA
Avnet Silica (Alt: PC28F00AP30TFA) RoHS: Compliant Min Qty: 1800 Package Multiple: 1800 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # PC28F00AP30TFA
EBV Elektronik (Alt: PC28F00AP30TFA) RoHS: Compliant Min Qty: 1800 Package Multiple: 1800 EBV - 0
Buy Now
Win Source Electronics Numonyx® Axcell™ P30-65nm Flash Memory 512-Mbit, 1-Gbit , 2-Gbit 100
  • 1 $361.1111
$361.1111 Buy Now

Part Details for PC28F00AP30TFA

PC28F00AP30TFA CAD Models

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PC28F00AP30TFA Part Data Attributes

Parametric Data
PC28F00AP30TFA Micron Technology Inc
Buy Now Datasheet
Compare Parts:
PC28F00AP30TFA Micron Technology Inc Flash, 64MX16, 100ns, PBGA64, BGA-64
Select a part to compare:
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description BGA-64
Pin Count 64
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Micron
Access Time-Max 100 ns
Additional Feature TOP BOOT
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B64
JESD-609 Code e1
Length 10 mm
Memory Density 1073741824 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 4,1023
Number of Terminals 64
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Page Size 16 words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Sector Size 16K,64K
Standby Current-Max 0.00024 A
Supply Current-Max 0.031 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit NO
Type NOR TYPE
Width 8 mm

Alternate Parts for PC28F00AP30TFA

This table gives cross-reference parts and alternative options found for PC28F00AP30TFA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC28F00AP30TFA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
RC28F00AP30TFA Micron Technology Inc Check for Price Flash, 64MX16, 100ns, PBGA64, BGA-64 PC28F00AP30TFA vs RC28F00AP30TFA
RC28F00AP30TF Micron Technology Inc Check for Price Flash, 64MX16, 100ns, PBGA64, 8 X 10 MM, 1.20 MM PITCH, BGA-64 PC28F00AP30TFA vs RC28F00AP30TF
PC28F00AP30TF Numonyx Memory Solutions Check for Price Flash, 64MX16, 100ns, PBGA64, 8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, BGA-64 PC28F00AP30TFA vs PC28F00AP30TF
Part Number Manufacturer Composite Price Description Compare
K8S1115EZC-FE1D0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30TFA vs K8S1115EZC-FE1D0
S29GL01GP13FAIV20 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30TFA vs S29GL01GP13FAIV20
S29GL01GP13FAIV13 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30TFA vs S29GL01GP13FAIV13
K8S1215EZC-DE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30TFA vs K8S1215EZC-DE1E0
K8S1015EBC-FC1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30TFA vs K8S1015EBC-FC1C0
K8S1115EZC-FC1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30TFA vs K8S1115EZC-FC1C0
S29GL01GP11FAIR12 Spansion Check for Price Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30TFA vs S29GL01GP11FAIR12
S29GL01GP11FFIV23 Spansion Check for Price Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30TFA vs S29GL01GP11FFIV23
S29GL01GP13FFIV10 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30TFA vs S29GL01GP13FFIV10
K8S1115EBC-SE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30TFA vs K8S1115EBC-SE1E0

PC28F00AP30TFA Related Parts

PC28F00AP30TFA Frequently Asked Questions (FAQ)

  • The PC28F00AP30TFA has an operating temperature range of -40°C to 85°C.

  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation.

  • The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal.

  • The device density and architecture can be determined by reading the device ID and manufacturer ID through the ID read command.

  • The WP# pin is used to prevent accidental writes to the device. When asserted low, the device is write-protected.