Datasheets
PC28F00AP30EFA by:
Micron Technology Inc
Glenair Inc
Honest Han
Intel Corporation
Micron Technology Inc
Not Found

Flash, 64MX16, 100ns, PBGA64, BGA-64

Part Details for PC28F00AP30EFA by Micron Technology Inc

Results Overview of PC28F00AP30EFA by Micron Technology Inc

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PC28F00AP30EFA Information

PC28F00AP30EFA by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for PC28F00AP30EFA

Part # Distributor Description Stock Price Buy
Bristol Electronics   1
RFQ
DISTI # PC28F00AP30EFA
Avnet Silica (Alt: PC28F00AP30EFA) RoHS: Compliant Min Qty: 1800 Package Multiple: 1800 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # PC28F00AP30EFA
EBV Elektronik (Alt: PC28F00AP30EFA) RoHS: Compliant Min Qty: 1800 Package Multiple: 1800 EBV - 0
Buy Now
Win Source Electronics IC FLASH 1GBIT 100NS 64EASYBGA / NOR Flash Parallel/Serial 1.8V 1G-bit 64M x 16 100ns 64-Pin BGA Tra... y more 5263
  • 1 $51.2361
  • 3 $47.9306
  • 4 $46.2778
  • 5 $42.9723
  • 7 $41.3195
  • 8 $39.6667
$39.6667 / $51.2361 Buy Now

Part Details for PC28F00AP30EFA

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PC28F00AP30EFA Part Data Attributes

PC28F00AP30EFA Micron Technology Inc
Buy Now Datasheet
Compare Parts:
PC28F00AP30EFA Micron Technology Inc Flash, 64MX16, 100ns, PBGA64, BGA-64
Select a part to compare:
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description BGA-64
Pin Count 64
Reach Compliance Code compliant
Samacsys Manufacturer Micron
Access Time-Max 100 ns
Additional Feature SYMMETRICAL BLOCKS
Command User Interface YES
Common Flash Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B64
JESD-609 Code e1
Length 10 mm
Memory Density 1073741824 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 64
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Page Size 16 words
Parallel/Serial PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Sector Size 64K
Standby Current-Max 0.00024 A
Supply Current-Max 0.031 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Toggle Bit NO
Type NOR TYPE
Width 8 mm

Alternate Parts for PC28F00AP30EFA

This table gives cross-reference parts and alternative options found for PC28F00AP30EFA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC28F00AP30EFA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
K8S1115EZC-FE1D0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30EFA vs K8S1115EZC-FE1D0
S29GL01GP13FAIV20 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30EFA vs S29GL01GP13FAIV20
S29GL01GP13FAIV13 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30EFA vs S29GL01GP13FAIV13
K8S1215EZC-DE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30EFA vs K8S1215EZC-DE1E0
K8S1015EBC-FC1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30EFA vs K8S1015EBC-FC1C0
K8S1115EZC-FC1C0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-64 PC28F00AP30EFA vs K8S1115EZC-FC1C0
S29GL01GP11FAIR12 Spansion Check for Price Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64 PC28F00AP30EFA vs S29GL01GP11FAIR12
S29GL01GP11FFIV23 Spansion Check for Price Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30EFA vs S29GL01GP11FFIV23
S29GL01GP13FFIV10 Spansion Check for Price Flash, 1GX1, 130ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30EFA vs S29GL01GP13FFIV10
K8S1115EBC-SE1E0 Samsung Semiconductor Check for Price Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64 PC28F00AP30EFA vs K8S1115EBC-SE1E0

PC28F00AP30EFA Related Parts

PC28F00AP30EFA Frequently Asked Questions (FAQ)

  • The PC28F00AP30EFA has an operating temperature range of -40°C to 85°C.

  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation.

  • The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal.

  • The device density is 256Mbit, and it is organized as 16M x 16 bits.

  • The WP# signal is used to protect the entire device or a specific sector from write operations when asserted low.