Part Details for PC107AMZFU100LB by Atmel Corporation
Overview of PC107AMZFU100LB by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
Part Details for PC107AMZFU100LB
PC107AMZFU100LB CAD Models
PC107AMZFU100LB Part Data Attributes:
|
PC107AMZFU100LB
Atmel Corporation
Buy Now
Datasheet
|
Compare Parts:
PC107AMZFU100LB
Atmel Corporation
Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, PLASTIC, FLIP CHIP, BGA-503
|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | BGA | |
Package Description | HBGA, BGA503,25X25,50 | |
Pin Count | 503 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | POWERPC 603E; POWERPC 740; POWERPC 750; PC7400; 60X | |
Clock Frequency-Max | 66 MHz | |
External Data Bus Width | 64 | |
JESD-30 Code | S-PBGA-B503 | |
JESD-609 Code | e0 | |
Length | 33 mm | |
Number of Terminals | 503 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA503,25X25,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.75 mm | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 33 mm |