Datasheets
P87LPC764BD,112 by: NXP Semiconductors

P87LPC764BDSOT163-1

Part Details for P87LPC764BD,112 by NXP Semiconductors

Overview of P87LPC764BD,112 by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for P87LPC764BD,112

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P87LPC764BD,112 Part Data Attributes:

P87LPC764BD,112 NXP Semiconductors
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P87LPC764BD,112 NXP Semiconductors P87LPC764BDSOT163-1
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOP
Package Description 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
Pin Count 20
Manufacturer Package Code SOT163-1
Reach Compliance Code unknown
Samacsys Manufacturer NXP
Has ADC NO
Additional Feature OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ
Address Bus Width
Bit Size 8
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDSO-G20
Length 12.8 mm
Number of I/O Lines 18
Number of Terminals 20
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
ROM Programmability OTPROM
Seated Height-Max 2.65 mm
Surface Mount YES
Technology CMOS
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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