There are no models available for this part yet.
Overview of P87LPC762FN by Philips Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for P87LPC762FN by Philips Semiconductors
Part Data Attributes for P87LPC762FN by Philips Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
PHILIPS SEMICONDUCTORS
|
Package Description
|
DIP, DIP20,.3
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Bit Size
|
8
|
CPU Family
|
8051
|
JESD-30 Code
|
R-PDIP-T20
|
JESD-609 Code
|
e4
|
Number of Terminals
|
20
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP20,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
128
|
ROM (words)
|
2048
|
ROM Programmability
|
UVPROM
|
Speed
|
20 MHz
|
Supply Current-Max
|
20 mA
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
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