Datasheets
P87LPC761BDH,112 by: NXP Semiconductors

P87LPC761 - Low power, low price, low pin count (16 pin) microcontroller with 2 kbyte OTP TSSOP 16-Pin

Part Details for P87LPC761BDH,112 by NXP Semiconductors

Overview of P87LPC761BDH,112 by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for P87LPC761BDH,112

Part # Distributor Description Stock Price Buy
Chip1Cloud IC MCU 8BIT 2KB OTP 16TSSOP 8300
RFQ
DISTI # 2314857
Farnell MCU, 8BIT, 8051, 20MHZ, TSSOP-16 RoHS: Compliant Min Qty: 1 Lead time: 52 Weeks, 1 Days Container: Each 0
  • 1 $1.8539
  • 25 $1.6910
  • 100 $1.5282
  • 250 $1.4155
  • 500 $1.2777
  • 900 $1.1725
  • 3,000 $1.0773
  • 6,000 $0.9908
$0.9908 / $1.8539 Buy Now

Part Details for P87LPC761BDH,112

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P87LPC761BDH,112 Part Data Attributes:

P87LPC761BDH,112 NXP Semiconductors
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P87LPC761BDH,112 NXP Semiconductors P87LPC761 - Low power, low price, low pin count (16 pin) microcontroller with 2 kbyte OTP TSSOP 16-Pin
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Pin Count 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Has ADC NO
Additional Feature ALSO OPERATES AT 2.7V MIN SUPPLY @ 10MHZ
Address Bus Width
Bit Size 8
CPU Family 8051
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 5 mm
Moisture Sensitivity Level 1
Number of I/O Lines 14
Number of Terminals 16
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 128
ROM (words) 2048
ROM Programmability OTPROM
Seated Height-Max 1.1 mm
Speed 20 MHz
Supply Current-Max 25 mA
Supply Voltage-Max 6 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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