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Microcontrollers and Processors / Microprocessors / P2020NSN2NHC
Datasheets
P2020NSN2NHC by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

1333MHz, RISC PROCESSOR, PBGA689

Part Details for P2020NSN2NHC by NXP Semiconductors

Results Overview of P2020NSN2NHC by NXP Semiconductors

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Applications Industrial Automation Renewable Energy Robotics and Drones

P2020NSN2NHC Information

P2020NSN2NHC by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for P2020NSN2NHC

Part # Distributor Description Stock Price Buy
DISTI # 85AK9523
Newark Qoriq, 32-Bit Power Arch Soc, 2 X 1.33Hz, Ddr2/3 W/Ecc, Gbe, Pcie, Srio, Usb, 0 To 125C, R2.1/ Tray ... Rohs Compliant: Yes |Nxp P2020NSN2NHC more RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $172.7800
$172.7800 Buy Now
Rochester Electronics QorIQ, 32-Bit Power Arch SoC, 2 X 1.33Hz, DDR2/3 w/ECC, GbE, PCIe, SRIO, USB, 0 to 125C, R2.1 RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 51
  • 1 $228.9800
  • 25 $224.4000
  • 100 $215.2400
  • 500 $206.0800
  • 1,000 $194.6300
$194.6300 / $228.9800 Buy Now
DISTI # P2020NSN2NHC
Avnet Silica QORIQ 32BIT POWER ARCH SOC 2 X 133HZ DDR23 WECC GBE (Alt: P2020NSN2NHC) RoHS: Compliant Min Qty: 27 Package Multiple: 27 Silica - 0
Buy Now

Part Details for P2020NSN2NHC

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P2020NSN2NHC Part Data Attributes

Parametric Data
P2020NSN2NHC NXP Semiconductors
Buy Now Datasheet
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P2020NSN2NHC NXP Semiconductors 1333MHz, RISC PROCESSOR, PBGA689
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description TEBGA-689
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 16
Boundary Scan YES
External Data Bus Width 64
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B689
JESD-609 Code e2
Length 31 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of DMA Channels 4
Number of External Interrupts 7
Number of Terminals 689
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA689,29X29,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.46 mm
Speed 1333 MHz
Supply Voltage-Max 1.1 V
Supply Voltage-Min 1 V
Supply Voltage-Nom 1.05 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 31 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

P2020NSN2NHC Related Parts

P2020NSN2NHC Frequently Asked Questions (FAQ)

  • NXP provides a reference design and layout guidelines in the P2020NSN2NHC Reference Manual (Document Number: P2020RM). Additionally, it's recommended to follow the thermal design guidelines in the NXP Thermal Management Application Note (Document Number: AN4865).

  • To optimize power consumption, use the Power Management Unit (PMU) to control the voltage and frequency of the processor. Also, use the Dynamic Voltage and Frequency Scaling (DVFS) feature to adjust the voltage and frequency based on the system's workload. Refer to the P2020NSN2NHC Reference Manual for more information.

  • The recommended settings for the DDR3 memory interface can be found in the P2020NSN2NHC DDR3 Design Guidelines Application Note (Document Number: AN4531). This document provides guidance on memory timing, signal integrity, and layout considerations.

  • NXP provides a Secure Boot solution for the P2020NSN2NHC, which involves using the Boot ROM and the Security Engine. Refer to the P2020NSN2NHC Secure Boot Application Note (Document Number: AN5125) for a detailed implementation guide.

  • The P2020NSN2NHC is rated for operation up to 105°C. However, it's essential to consider thermal management, power consumption, and reliability when operating in high-temperature environments. Refer to the NXP Thermal Management Application Note (Document Number: AN4865) and the P2020NSN2NHC datasheet for more information.