Part Details for P1025NXE5DFB by NXP Semiconductors
Overview of P1025NXE5DFB by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for P1025NXE5DFB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9504
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Newark | Qoriq, Power Arch 32-Bit Soc, 2 X 533Mhz, Gbe, Ddr3, Ecc, Qe, Pcie, Usb, Tdm, Sec, -40 To 125C, R1.1/ Tray Rohs Compliant: Yes |Nxp P1025NXE5DFB RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$78.0100 / $82.8800 | Buy Now |
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Flip Electronics | Stock | 120 |
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RFQ |
Part Details for P1025NXE5DFB
P1025NXE5DFB CAD Models
P1025NXE5DFB Part Data Attributes
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P1025NXE5DFB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
P1025NXE5DFB
NXP Semiconductors
SoC, CMOS, PBGA561
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FBGA-561 | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B561 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 561 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA561,27X27,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.3 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |