Part Details for P1025NXE5DFB by NXP Semiconductors
Results Overview of P1025NXE5DFB by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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P1025NXE5DFB Information
P1025NXE5DFB by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P1025NXE5DFB
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9504
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Newark | Qoriq, Power Arch 32-Bit Soc, 2 X 533Mhz, Gbe, Ddr3, Ecc, Qe, Pcie, Usb, Tdm, Sec, -40 To 125C, R1.1... more RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$78.0100 / $82.8800 | Buy Now |
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Flip Electronics | Stock | 218 |
|
RFQ |
Part Details for P1025NXE5DFB
P1025NXE5DFB CAD Models
P1025NXE5DFB Part Data Attributes
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P1025NXE5DFB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
P1025NXE5DFB
NXP Semiconductors
SoC, CMOS, PBGA561
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FBGA-561 | |
Reach Compliance Code | unknown | |
JESD-30 Code | S-PBGA-B561 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 561 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA561,27X27,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.3 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | SoC |