Part Details for P1013NSN2EFB by Freescale Semiconductor
Results Overview of P1013NSN2EFB by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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P1013NSN2EFB Information
P1013NSN2EFB by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for P1013NSN2EFB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | P1013 - QoriQ Single-Core Communications Processor RoHS: Compliant Status: Obsolete Min Qty: 1 | 1 |
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$57.3500 / $67.4700 | Buy Now |
Part Details for P1013NSN2EFB
P1013NSN2EFB CAD Models
P1013NSN2EFB Part Data Attributes
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P1013NSN2EFB
Freescale Semiconductor
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Datasheet
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Compare Parts:
P1013NSN2EFB
Freescale Semiconductor
QorIQ, 32 Bit Power Arch SoC, 600MHz, GbE, PCIe, USB, DDR2/3, ECC,LCD, 0 to 105C, Rev 2
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | TEBGAII-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| JESD-609 Code | e2 | |
| Length | 31 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 689 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.46 mm | |
| Speed | 600 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |