Part Details for OMAPL138BZWT4 by Texas Instruments
Overview of OMAPL138BZWT4 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Healthcare
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Price & Stock for OMAPL138BZWT4
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | DIGITAL SIGNAL PROCESSOR, 0-EXT BIT, 50MHZ, CMOS, PBGA361 | 21 |
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$54.8828 / $64.5680 | Buy Now |
Part Details for OMAPL138BZWT4
OMAPL138BZWT4 CAD Models
OMAPL138BZWT4 Part Data Attributes:
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OMAPL138BZWT4
Texas Instruments
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Datasheet
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OMAPL138BZWT4
Texas Instruments
0-BIT, 50MHz, OTHER DSP, PBGA361, 16 X 16 MM, 0.80 MM PITCH, GREEN, PLASTIC, NFBGA-361
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA361,19X19,32 | |
| Pin Count | 361 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY | |
| JESD-30 Code | S-PBGA-B361 | |
| JESD-609 Code | e1 | |
| Length | 16 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 361 | |
| Operating Temperature-Max | 90 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA361,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max | 1.35 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |