Part Details for OMAPL138BZCEA3 by Texas Instruments
Overview of OMAPL138BZCEA3 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Price & Stock for OMAPL138BZCEA3
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 113 |
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RFQ |
Part Details for OMAPL138BZCEA3
OMAPL138BZCEA3 CAD Models
OMAPL138BZCEA3 Part Data Attributes
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OMAPL138BZCEA3
Texas Instruments
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Datasheet
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OMAPL138BZCEA3
Texas Instruments
0-BIT, 50MHz, OTHER DSP, PBGA361, 13 X 13 MM, 0.65 MM PITCH, GREEN, PLASTIC, NFBGA-361
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | 13 X 13 MM, 0.65 MM PITCH, GREEN, PLASTIC, NFBGA-361 | |
Pin Count | 361 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY | |
JESD-30 Code | S-PBGA-B361 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 361 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA361,19X19,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.3 mm | |
Supply Voltage-Max | 1.35 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm | |
uPs/uCs/Peripheral ICs Type | SoC |