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Part Details for OMAPL138BGWTMEP by Texas Instruments
Overview of OMAPL138BGWTMEP by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
Price & Stock for OMAPL138BGWTMEP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-33467-5-ND
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DigiKey | IC MPU OMAP-L1X 345MHZ 361NFBGA Min Qty: 1 Lead time: 6 Weeks Container: Tube |
70 In Stock |
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$76.2780 / $88.9000 | Buy Now |
|
DISTI #
595-OMAPL138BGWTMEP
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC EP Low-Pwr App Proc RoHS: Not Compliant | 90 |
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$76.2700 / $88.8700 | Buy Now |
|
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Ameya Holding Limited | IC MPU OMAP-L1X 345MHZ 361NFBGA | 5042 |
|
RFQ |
Part Details for OMAPL138BGWTMEP
OMAPL138BGWTMEP CAD Models
OMAPL138BGWTMEP Part Data Attributes:
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OMAPL138BGWTMEP
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
OMAPL138BGWTMEP
Texas Instruments
Enhanced product low power C674x floating-point DSP + Arm9 processor - 345 MHz 361-NFBGA -55 to 125
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| Pbfree Code | Yes | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA361,19X19,32 | |
| Pin Count | 361 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| JESD-30 Code | S-PBGA-B361 | |
| JESD-609 Code | e0 | |
| Length | 16 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 361 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA361,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 220 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |