Part Details for OMAP3530ECBC72 by Texas Instruments
Overview of OMAP3530ECBC72 by Texas Instruments
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Part Details for OMAP3530ECBC72
OMAP3530ECBC72 CAD Models
OMAP3530ECBC72 Part Data Attributes
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OMAP3530ECBC72
Texas Instruments
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Datasheet
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OMAP3530ECBC72
Texas Instruments
Applications Processor 515-POP-FCBGA 0 to 0
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | VFBGA, BGA515,26X26,20 | |
Pin Count | 515 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B515 | |
JESD-609 Code | e1 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 515 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA515,26X26,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.95 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |