Part Details for OMAP3515DCUSA by Texas Instruments
Overview of OMAP3515DCUSA by Texas Instruments
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Part Details for OMAP3515DCUSA
OMAP3515DCUSA CAD Models
OMAP3515DCUSA Part Data Attributes:
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OMAP3515DCUSA
Texas Instruments
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OMAP3515DCUSA
Texas Instruments
Applications Processor 423-FCBGA -40 to 105
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA423,24X24,25 | |
Pin Count | 423 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B423 | |
JESD-609 Code | e1 | |
Length | 16 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 423 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA423,24X24,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 16 mm | |
uPs/uCs/Peripheral ICs Type | SoC |