Part Details for OMAP3503DCBB by Texas Instruments
Overview of OMAP3503DCBB by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Price & Stock for OMAP3503DCBB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 1 | 567 |
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$24.6000 / $30.0000 | Buy Now |
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Quest Components | DIGITAL SIGNAL PROCESSOR, 16-EXT BIT, 59MHZ, CMOS, PBGA515 | 453 |
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$26.2500 / $32.5000 | Buy Now |
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Rochester Electronics | OMAP Digital Signal Processor, 16-Ext Bit, 59MHz, CMOS, PBGA515 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 11581 |
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$27.9400 / $32.8800 | Buy Now |
Part Details for OMAP3503DCBB
OMAP3503DCBB CAD Models
OMAP3503DCBB Part Data Attributes:
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OMAP3503DCBB
Texas Instruments
Buy Now
Datasheet
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OMAP3503DCBB
Texas Instruments
Applications Processor 515-POP-FCBGA 0 to 90
|
| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, POPFCBGA-515 | |
| Pin Count | 515 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B515 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 515 | |
| Operating Temperature-Max | 90 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA515,23X23,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max | 1.91 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |