Part Details for NX25P16-VFI by Winbond Electronics Corp
Overview of NX25P16-VFI by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for NX25P16-VFI
NX25P16-VFI CAD Models
NX25P16-VFI Part Data Attributes
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NX25P16-VFI
Winbond Electronics Corp
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Datasheet
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NX25P16-VFI
Winbond Electronics Corp
16MX1 FLASH 2.7V PROM, PDSO16, 0.300 INCH, SOIC-16
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | SOIC | |
| Package Description | 0.300 INCH, SOIC-16 | |
| Pin Count | 16 | |
| Reach Compliance Code | compliant | |
| Clock Frequency-Max (fCLK) | 25 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e0 | |
| Length | 10.285 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Power Supplies | 3/3.3 V | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.64 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE | |
| Width | 7.49 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for NX25P16-VFI
This table gives cross-reference parts and alternative options found for NX25P16-VFI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NX25P16-VFI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NX25P16-VFI-T | Flash, 2MX8, PDSO16, SOIC-16 | Winbond Electronics Corp | NX25P16-VFI vs NX25P16-VFI-T |
| S25FL016A0LMAI000 | Flash, 16MX1, PDSO16, 0.300 INCH, PLASTIC, MS-013AA, SOP-16 | Spansion | NX25P16-VFI vs S25FL016A0LMAI000 |
| S25FL016A0LMFI000 | Flash, 16MX1, PDSO16, 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16 | Spansion | NX25P16-VFI vs S25FL016A0LMFI000 |