Part Details for NX25F011B-3S by Nexflash Technologies Inc
Overview of NX25F011B-3S by Nexflash Technologies Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for NX25F011B-3S
NX25F011B-3S CAD Models
NX25F011B-3S Part Data Attributes:
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NX25F011B-3S
Nexflash Technologies Inc
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Datasheet
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NX25F011B-3S
Nexflash Technologies Inc
Flash, 132KX8, PDSO28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEXFLASH TECHNOLOGIES INC | |
Package Description | TSSOP, TSSOP28,.53,22 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 8 MHz | |
Endurance | 10000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G28 | |
JESD-609 Code | e0 | |
Memory Density | 1081344 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Terminals | 28 | |
Number of Words | 135168 words | |
Number of Words Code | 132000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 132KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP28,.53,22 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.00001 A | |
Supply Current-Max | 0.01 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.55 mm | |
Terminal Position | DUAL | |
Type | NOR TYPE | |
Write Protection | HARDWARE/SOFTWARE |