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Transistors / Small Signal Field-Effect Transistors / NTMS4503NR2G
Datasheets
NTMS4503NR2G by: onsemi

Power MOSFET 28V 14A 7 mOhm Single N-Channel SO-8, SOIC-8 Narrow Body, 2500-REEL

Part Details for NTMS4503NR2G by onsemi

Results Overview of NTMS4503NR2G by onsemi

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NTMS4503NR2G Information

NTMS4503NR2G by onsemi is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for NTMS4503NR2G

Part # Distributor Description Stock Price Buy
DISTI # 86017087
Verical Trans MOSFET N-CH 28V 12A 8-Pin SOIC N T/R RoHS: Compliant Min Qty: 810 Package Multiple: 1 Date Code: 1601 Americas - 129500
  • 810 $0.4631
  • 1,000 $0.4374
$0.4374 / $0.4631 Buy Now
Bristol Electronics   307
RFQ
Rochester Electronics NTMS4503N - Small Signal Field-Effect Transistor, 9A, 28V, N-Channel MOSFET ' RoHS: Compliant Status: Obsolete Min Qty: 1 130141
  • 1 $0.4117
  • 25 $0.4035
  • 100 $0.3870
  • 500 $0.3705
  • 1,000 $0.3499
$0.3499 / $0.4117 Buy Now

Part Details for NTMS4503NR2G

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NTMS4503NR2G Part Data Attributes

Parametric Data
NTMS4503NR2G onsemi
Buy Now Datasheet
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NTMS4503NR2G onsemi Power MOSFET 28V 14A 7 mOhm Single N-Channel SO-8, SOIC-8 Narrow Body, 2500-REEL
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code SOIC-8 Narrow Body
Pin Count 8
Manufacturer Package Code 751-07
Reach Compliance Code compliant
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

NTMS4503NR2G Related Parts

NTMS4503NR2G Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the IC and to connect it to a heat sink or a thermal plane.

  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the IC and the heat sink. Additionally, consider using thermal interface materials and ensure that the PCB is designed to handle high temperatures.

  • Exceeding the maximum junction temperature can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the IC operates within the recommended temperature range to maintain its performance and lifespan.

  • The NTMS4503NR2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and ensuring that the device is not exposed to static electricity during handling.

  • The recommended storage and handling conditions for the NTMS4503NR2G include storing the device in a dry, cool place, away from direct sunlight and moisture. It's also essential to handle the device by the body, rather than the leads, to prevent damage and ensure proper ESD protection.