Datasheets
NT5DS16M16BT-6K by: Nanya Technology Corporation

DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66

Part Details for NT5DS16M16BT-6K by Nanya Technology Corporation

Overview of NT5DS16M16BT-6K by Nanya Technology Corporation

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Applications Consumer Electronics Computing and Data Storage

Price & Stock for NT5DS16M16BT-6K

Part # Distributor Description Stock Price Buy
Quest Components 16M X 16 DDR DRAM, 0.7 ns, PDSO66 320
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Part Details for NT5DS16M16BT-6K

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NT5DS16M16BT-6K Part Data Attributes

NT5DS16M16BT-6K Nanya Technology Corporation
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NT5DS16M16BT-6K Nanya Technology Corporation DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NANYA TECHNOLOGY CORP
Part Package Code TSOP2
Package Description TSOP2, TSSOP66,.46
Pin Count 66
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66
JESD-609 Code e0
Length 22.22 mm
Memory Density 268435456 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 66
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for NT5DS16M16BT-6K

This table gives cross-reference parts and alternative options found for NT5DS16M16BT-6K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NT5DS16M16BT-6K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT46V16M16TG-6TES:C DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc NT5DS16M16BT-6K vs MT46V16M16TG-6TES:C
HY5DU561622FTP-5I DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc NT5DS16M16BT-6K vs HY5DU561622FTP-5I
HYB25DC256160CE-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Qimonda AG NT5DS16M16BT-6K vs HYB25DC256160CE-6
N2DS25H16BS-6K DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, GREEN, PLASTIC, TSOP2-66 Nanya Technology Corporation NT5DS16M16BT-6K vs N2DS25H16BS-6K
HY5DU561622ETP-J DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc NT5DS16M16BT-6K vs HY5DU561622ETP-J
W9425G6DH-4 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 Winbond Electronics Corp NT5DS16M16BT-6K vs W9425G6DH-4
K4H561638F-TLB30 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor NT5DS16M16BT-6K vs K4H561638F-TLB30
HY5DU561622CTP-5 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 SK Hynix Inc NT5DS16M16BT-6K vs HY5DU561622CTP-5
HYB25D256160CE-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Infineon Technologies AG NT5DS16M16BT-6K vs HYB25D256160CE-6
K4H561638F-ULB30 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor NT5DS16M16BT-6K vs K4H561638F-ULB30
Part Number Description Manufacturer Compare
V58C2256164SCLE6I DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC TSOP2-66 ProMOS Technologies Inc NT5DS16M16BT-6K vs V58C2256164SCLE6I
MT46V16M16P-6TIT DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc NT5DS16M16BT-6K vs MT46V16M16P-6TIT
EDD2516KCTA-6BS-E DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, PLASTIC, TSOP2-66 Elpida Memory Inc NT5DS16M16BT-6K vs EDD2516KCTA-6BS-E
H5DU2562GTR-E3J DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc NT5DS16M16BT-6K vs H5DU2562GTR-E3J
MT46V16M16TG-6RITH 16MX16 DDR DRAM, 0.7ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc NT5DS16M16BT-6K vs MT46V16M16TG-6RITH
K4H561638F-UCB3T DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor NT5DS16M16BT-6K vs K4H561638F-UCB3T
IS43R16160D-5TLI DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSSOP2-66 Integrated Silicon Solution Inc NT5DS16M16BT-6K vs IS43R16160D-5TLI
H5DU2562GTR-J3C DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc NT5DS16M16BT-6K vs H5DU2562GTR-J3C
V58C2256164SBT6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc NT5DS16M16BT-6K vs V58C2256164SBT6
V58C2256164SALN-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66 ProMOS Technologies Inc NT5DS16M16BT-6K vs V58C2256164SALN-6

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