Part Details for NT2H1311F0DTL by NXP Semiconductors
Overview of NT2H1311F0DTL by NXP Semiconductors
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for NT2H1311F0DTL
NT2H1311F0DTL CAD Models
NT2H1311F0DTL Part Data Attributes:
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NT2H1311F0DTL
NXP Semiconductors
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Datasheet
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NT2H1311F0DTL
NXP Semiconductors
SPECIALTY TELECOM CIRCUIT, PDSO4, 2 X 1.50 MM, 0.50 MM, PLASTIC, SOT1312AB2, HXSON-4
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 2 X 1.50 MM, 0.50 MM, PLASTIC, SOT1312AB2, HXSON-4 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-PDSO-N4 | |
Length | 2 mm | |
Number of Functions | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Seated Height-Max | 0.5 mm | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | OTHER | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Width | 1.5 mm |