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Sensors/Transducers / Image Sensors / NOIL1SE3000A-GDC
Datasheets
NOIL1SE3000A-GDC by: onsemi

CMOS Image Sensor, High Speed, 3 MP LVDS Output, Bayer Color, Microlens, micro-PGA package, sealed glass (D263), CPGA369, 31x27, 14-JTRAY

Part Details for NOIL1SE3000A-GDC by onsemi

Results Overview of NOIL1SE3000A-GDC by onsemi

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NOIL1SE3000A-GDC Information

NOIL1SE3000A-GDC by onsemi is an Image Sensor.
Image Sensors are under the broader part category of Sensors/Transducers.

Sensors and transducers detect and measure physical quantities like temperature, pressure, and force, converting them into electrical signals for various applications. Read more about Sensors/Transducers on our Sensors/Transducers part category page.

Price & Stock for NOIL1SE3000A-GDC

Part # Distributor Description Stock Price Buy
DISTI # 65T1480
Newark Lupa3000 Color Ml Pga369/Jtray |Onsemi NOIL1SE3000A-GDC RoHS: Not Compliant Min Qty: 14 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
Rochester Electronics LUPA3000 - CMOS Image Sensor, High Speed, 3 MP LVDS Output, Bayer Color, Microlens RoHS: Compliant Status: Obsolete Min Qty: 1 8
  • 1 $2,057.2800
  • 25 $2,016.1300
  • 100 $1,933.8400
  • 500 $1,851.5500
  • 1,000 $1,748.6900
$1,748.6900 / $2,057.2800 Buy Now
DISTI # NOIL1SE3000A-GDC
Avnet Silica Image Sensor Color CMOS 1696x1710Pixels 369Pin uPGA Tray (Alt: NOIL1SE3000A-GDC) RoHS: Compliant Min Qty: 14 Package Multiple: 14 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # NOIL1SE3000A-GDC
EBV Elektronik Image Sensor Color CMOS 1696x1710Pixels 369Pin uPGA Tray (Alt: NOIL1SE3000A-GDC) RoHS: Compliant Min Qty: 14 Package Multiple: 14 Lead time: 143 Weeks, 0 Days EBV - 0
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Wuhan P&S   Min Qty: 1 14
  • 1 $5,162.9500
  • 100 $3,295.5000
  • 500 $2,717.3400
  • 1,000 $2,498.2000
$2,498.2000 / $5,162.9500 Buy Now

Part Details for NOIL1SE3000A-GDC

NOIL1SE3000A-GDC CAD Models

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NOIL1SE3000A-GDC Part Data Attributes

Parametric Data
NOIL1SE3000A-GDC onsemi
Buy Now Datasheet
Compare Parts:
NOIL1SE3000A-GDC onsemi CMOS Image Sensor, High Speed, 3 MP LVDS Output, Bayer Color, Microlens, micro-PGA package, sealed glass (D263), CPGA369, 31x27, 14-JTRAY
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code CPGA369, 31x27
Package Description UPGA-369
Pin Count 369
Manufacturer Package Code 107DK
Reach Compliance Code compliant
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Array Type FRAME
Body Breadth 27 mm
Body Height 4.3 mm
Body Length or Diameter 31 mm
Dynamic Range 80 dB
Frame Rate 485 fps
Horizontal Pixel 1696
Housing CERAMIC
JESD-609 Code e3
Master Clock 206 MHz
Mounting Feature SURFACE MOUNT
Operating Current-Max 0.02 mA
Operating Temperature-Max 60 °C
Operating Temperature-Min
Optical Format 1.2 inch
Output Type DIGITAL OUTPUT
Package Shape/Style RECTANGULAR
Pixel Size 8X8 µm
Sensors/Transducers Type IMAGE SENSOR,CMOS
Spectral Response (nm) 400-1100
Supply Voltage-Max 2.75 V
Supply Voltage-Min 2.25 V
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Termination Type SOLDER
Vertical Pixel 1710

NOIL1SE3000A-GDC Frequently Asked Questions (FAQ)

  • A good PCB layout should ensure minimal thermal resistance, use a solid ground plane, and keep the device away from high-current paths. A thermal pad on the bottom of the package should be connected to a thermal vias array to dissipate heat efficiently.

  • Choose an input capacitor with a low ESR (Equivalent Series Resistance), high ripple current rating, and a voltage rating that exceeds the maximum input voltage. A ceramic capacitor with X7R or X5R dielectric is recommended. The capacitor value should be between 10uF to 22uF.

  • The maximum allowed voltage drop across the input capacitor is typically around 1V to 2V. Exceeding this value may affect the device's performance and reliability.

  • While the device is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management to ensure reliable operation. Consult the datasheet and onsemi's application notes for guidance on high-temperature operation.

  • Start by verifying the input voltage, output load, and PCB layout. Check for proper thermal management, input capacitor selection, and output capacitor selection. Use oscilloscopes and thermal imaging cameras to identify issues. Consult onsemi's application notes and technical support for further assistance.