Part Details for NMC87C257Q200 by National Semiconductor Corporation
Overview of NMC87C257Q200 by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for NMC87C257Q200
NMC87C257Q200 CAD Models
NMC87C257Q200 Part Data Attributes
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NMC87C257Q200
National Semiconductor Corporation
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Datasheet
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NMC87C257Q200
National Semiconductor Corporation
IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | WDIP, DIP28,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
Additional Feature | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for NMC87C257Q200
This table gives cross-reference parts and alternative options found for NMC87C257Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC87C257Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TMS27PC256-20NE4 | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | NMC87C257Q200 vs TMS27PC256-20NE4 |
27C256MQB/C20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | NMC87C257Q200 vs 27C256MQB/C20 |
DM27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | NMC87C257Q200 vs DM27C256-20 |
8411103YX | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | NMC87C257Q200 vs 8411103YX |
TMX27PC256-20NL | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | NMC87C257Q200 vs TMX27PC256-20NL |
DM27C256-20/B | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | NMC87C257Q200 vs DM27C256-20/B |
AS27C256A-20JI/MIL | Memory IC | Micross Components | NMC87C257Q200 vs AS27C256A-20JI/MIL |
CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | NMC87C257Q200 vs CY27C256A-200WI |
NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | NMC87C257Q200 vs NM27C256N200 |
QP27256-2 | OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28 | Intel Corporation | NMC87C257Q200 vs QP27256-2 |