There are no models available for this part yet.
Overview of NMC27C256QE250 by Texas Instruments
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
CAD Models for NMC27C256QE250 by Texas Instruments
Part Data Attributes for NMC27C256QE250 by Texas Instruments
|
|
|
|---|---|
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Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
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Part Package Code
|
DIP
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|
Package Description
|
WDIP, DIP28,.6
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|
Pin Count
|
28
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|
Reach Compliance Code
|
unknown
|
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.61
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|
Access Time-Max
|
250 ns
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I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T28
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|
JESD-609 Code
|
e0
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Memory Density
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262144 bit
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Memory IC Type
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UVPROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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28
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Number of Words
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32768 words
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Number of Words Code
|
32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
32KX8
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Code
|
WDIP
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|
Package Equivalence Code
|
DIP28,.6
|
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE, WINDOW
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Parallel/Serial
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PARALLEL
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Programming Voltage
|
13 V
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Qualification Status
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Not Qualified
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Seated Height-Max
|
5.715 mm
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Standby Current-Max
|
0.0001 A
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Supply Current-Max
|
0.02 mA
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
|
4.5 V
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Supply Voltage-Nom (Vsup)
|
5 V
|
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Surface Mount
|
NO
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Technology
|
CMOS
|
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Temperature Grade
|
INDUSTRIAL
|
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Terminal Finish
|
TIN LEAD
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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Terminal Position
|
DUAL
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Width
|
15.24 mm
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Alternate Parts for NMC27C256QE250
This table gives cross-reference parts and alternative options found for NMC27C256QE250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C256QE250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM27C256A-25WZ | 32KX8 UVPROM, 250ns, CDIP28, CERDIP-28 | FUJITSU Limited | NMC27C256QE250 vs MBM27C256A-25WZ |
| M27256-25F1 | 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | NMC27C256QE250 vs M27256-25F1 |
| AM27256DEB | UVPROM, 32KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | NMC27C256QE250 vs AM27256DEB |
| AM27C256-250DIB | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NMC27C256QE250 vs AM27C256-250DIB |
| SMJ27C256-25J | 32KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | NMC27C256QE250 vs SMJ27C256-25J |
| NMC27C256BQ25 | IC 32K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | NMC27C256QE250 vs NMC27C256BQ25 |
| AM27C256-250DCB | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NMC27C256QE250 vs AM27C256-250DCB |
| AM27C256-250DI | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NMC27C256QE250 vs AM27C256-250DI |
| AT27C256R-25DC | UVPROM, 32KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | NMC27C256QE250 vs AT27C256R-25DC |
| AT27C256R-25DI | UVPROM, 32KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | NMC27C256QE250 vs AT27C256R-25DI |