Part Details for NMC27C16-30 by National Semiconductor Corporation
Overview of NMC27C16-30 by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Part Details for NMC27C16-30
NMC27C16-30 CAD Models
NMC27C16-30 Part Data Attributes
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NMC27C16-30
National Semiconductor Corporation
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Datasheet
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NMC27C16-30
National Semiconductor Corporation
IC 2K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | WDIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 16384 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 25 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for NMC27C16-30
This table gives cross-reference parts and alternative options found for NMC27C16-30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C16-30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2716B-300DI | UVPROM, 2KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16-30 vs AM2716B-300DI |
| AM2716B-305DC | UVPROM, 2KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16-30 vs AM2716B-305DC |
| AM2716B-305DI | UVPROM, 2KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16-30 vs AM2716B-305DI |
| AM2716B-300/BJA | UVPROM, 2KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16-30 vs AM2716B-300/BJA |
| NMC27C16-30 | IC 2K X 8 UVPROM, 300 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | NMC27C16-30 vs NMC27C16-30 |