Part Details for NHPXA270C0C312 by Intel Corporation
Overview of NHPXA270C0C312 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for NHPXA270C0C312
NHPXA270C0C312 CAD Models
NHPXA270C0C312 Part Data Attributes
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NHPXA270C0C312
Intel Corporation
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Datasheet
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NHPXA270C0C312
Intel Corporation
RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 26 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 13.002 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.59 mm | |
| Speed | 312 MHz | |
| Supply Voltage-Max | 1.705 V | |
| Supply Voltage-Min | 1.1875 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for NHPXA270C0C312
This table gives cross-reference parts and alternative options found for NHPXA270C0C312. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NHPXA270C0C312, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXC750AVGB/Q10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | NHPXA270C0C312 vs TSXC750AVGB/Q10LH |
| IBM25EMPPC750DBUB2330 | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | NHPXA270C0C312 vs IBM25EMPPC750DBUB2330 |
| TSPC750AMGU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | NHPXA270C0C312 vs TSPC750AMGU10LE |
| MPC755BPX350RD | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, PLASTIC, BGA-360 | Motorola Semiconductor Products | NHPXA270C0C312 vs MPC755BPX350RD |
| PCX7410MGHU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 | Atmel Corporation | NHPXA270C0C312 vs PCX7410MGHU450LE |
| TSPC750AMGB/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | NHPXA270C0C312 vs TSPC750AMGB/T10LH |
| PC750PVGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CICGA-360 | Atmel Corporation | NHPXA270C0C312 vs PC750PVGSU300LE |
| PC7447MGU1050LB | RISC Microprocessor, 32-Bit, 1050MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | NHPXA270C0C312 vs PC7447MGU1050LB |
| PC7447VGU650LB | RISC Microprocessor, 32-Bit, 650MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | NHPXA270C0C312 vs PC7447VGU650LB |
| PPC7448HX1400NC | 32-BIT, 1400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | NHPXA270C0C312 vs PPC7448HX1400NC |