Datasheets
NCP6151D52MNR2G by:
onsemi
Hongxing Electrical Ltd
onsemi
Not Found

VR12 2-, 3-, 4-Phase CPU Controller + 1-Phase GPU Controller, QFN52, 6x6, 0.65P, 2500-REEL

Part Details for NCP6151D52MNR2G by onsemi

Results Overview of NCP6151D52MNR2G by onsemi

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

NCP6151D52MNR2G Information

NCP6151D52MNR2G by onsemi is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for NCP6151D52MNR2G

Part # Distributor Description Stock Price Buy
Rochester Electronics Analog Circuit, 1 Func RoHS: Compliant Status: Active Min Qty: 1 20
  • 1 $1.1600
  • 25 $1.1400
  • 100 $1.0900
  • 500 $1.0400
  • 1,000 $0.9860
$0.9860 / $1.1600 Buy Now

Part Details for NCP6151D52MNR2G

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NCP6151D52MNR2G Part Data Attributes

NCP6151D52MNR2G onsemi
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NCP6151D52MNR2G onsemi VR12 2-, 3-, 4-Phase CPU Controller + 1-Phase GPU Controller, QFN52, 6x6, 0.65P, 2500-REEL
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code QFN52, 6x6, 0.65P
Package Description 6 X 6 MM, 0.65 MM PITCH, HALOGEN AND LEAD FREE, QFN-52
Pin Count 52
Manufacturer Package Code 485AV
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi

NCP6151D52MNR2G Related Parts

NCP6151D52MNR2G Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A 4-layer PCB with a dedicated thermal layer is also recommended.

  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering and assembly techniques.

  • Operating the device beyond the recommended input voltage range can lead to reduced reliability, increased power consumption, and potentially even damage to the device. It's essential to ensure that the input voltage remains within the specified range to guarantee reliable operation.

  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output load, and feedback resistors. Check for any signs of overheating, and ensure that the device is properly soldered and assembled. If issues persist, consult the datasheet and application notes for guidance.

  • To minimize EMI and RFI, follow proper PCB layout and design guidelines, use shielding and filtering components as needed, and ensure that the device is properly decoupled. Additionally, consider using EMI-compliant components and following regulatory guidelines for your specific application.