Part Details for NCD471K1KVY5FKTBF by NIC Components Corp
Overview of NCD471K1KVY5FKTBF by NIC Components Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for NCD471K1KVY5FKTBF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
NCD471K1KVY5FKTBF
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Avnet Americas | NCD471K1KVY5FKTBF - Ammo Pack (Alt: NCD471K1KVY5FKTBF) RoHS: Compliant Min Qty: 6000 Package Multiple: 2000 Lead time: 20 Weeks, 0 Days Container: Ammo Pack | 8000 Factory Stock |
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$0.0330 / $0.0350 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 6000 Package Multiple: 2000 | 0 |
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$0.0333 | Buy Now |
DISTI #
20997769
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Verical | NCD471K1KVY5FKTBF Min Qty: 2000 Package Multiple: 2000 | Americas - 4000 |
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$0.0513 | Buy Now |
Part Details for NCD471K1KVY5FKTBF
NCD471K1KVY5FKTBF CAD Models
NCD471K1KVY5FKTBF Part Data Attributes
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NCD471K1KVY5FKTBF
NIC Components Corp
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Datasheet
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NCD471K1KVY5FKTBF
NIC Components Corp
Ceramic Capacitor, Ceramic, 1000V, 10% +Tol, 10% -Tol, Y5F, 7.5% TC, 0.00047uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NIC COMPONENTS CORP | |
Package Description | , | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8532.23.00.60 | |
Factory Lead Time | 20 Weeks | |
Capacitance | 0.00047 µF | |
Capacitor Type | CERAMIC CAPACITOR | |
Dielectric Material | CERAMIC | |
Mounting Feature | THROUGH HOLE MOUNT | |
Multilayer | No | |
Negative Tolerance | 10% | |
Number of Terminals | 2 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Package Shape | DISK PACKAGE | |
Packing Method | AMMO PACK | |
Positive Tolerance | 10% | |
Rated (DC) Voltage (URdc) | 1000 V | |
Surface Mount | NO | |
Temperature Characteristics Code | Y5F | |
Temperature Coefficient | 7.5% ppm/°C | |
Terminal Shape | WIRE |