Part Details for N82S191CF by Philips Semiconductors
Overview of N82S191CF by Philips Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Price & Stock for N82S191CF
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 8 |
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RFQ |
Part Details for N82S191CF
N82S191CF CAD Models
N82S191CF Part Data Attributes
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N82S191CF
Philips Semiconductors
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Datasheet
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N82S191CF
Philips Semiconductors
OTP ROM, 2KX8, 35ns, TTL, CDIP24
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-XDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 16384 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2KX8 | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | TTL | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |