Datasheets
N25Q512A83G1241F by: Micron Technology Inc

Flash, 512MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24

Part Details for N25Q512A83G1241F by Micron Technology Inc

Results Overview of N25Q512A83G1241F by Micron Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Consumer Electronics Education and Research Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

N25Q512A83G1241F Information

N25Q512A83G1241F by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for N25Q512A83G1241F

Part # Distributor Description Stock Price Buy
DISTI # N25Q512A83G1241F
Avnet Americas - Tape and Reel (Alt: N25Q512A83G1241F) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 18 Weeks, 0 Days Container: Reel 0
RFQ
DISTI # N25Q512A83G1241F
Avnet Americas - Tape and Reel (Alt: N25Q512A83G1241F) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 18 Weeks, 0 Days Container: Reel 0
RFQ

Part Details for N25Q512A83G1241F

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N25Q512A83G1241F Part Data Attributes

N25Q512A83G1241F Micron Technology Inc
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N25Q512A83G1241F Micron Technology Inc Flash, 512MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Factory Lead Time 18 Weeks
Samacsys Manufacturer Micron
Clock Frequency-Max (fCLK) 108 MHz
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 536870912 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Serial Bus Type QSPI
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

N25Q512A83G1241F Related Parts

N25Q512A83G1241F Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the N25Q512A83G1241F is -40°C to +125°C.

  • The HOLD# signal should be asserted low to pause the current read or write operation, and de-asserted high to resume the operation.

  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal (CLK).

  • The device density and configuration can be determined by reading the Device ID (JEDEC ID) and the Configuration Register (CR).

  • The WP# signal is used to protect the status register and the configuration register from being modified. When WP# is low, these registers are write-protected.