Datasheets
N25Q256A83E1241F by: Micron Technology Inc

Flash, 256MX1, PBGA24, TBGA-24

Part Details for N25Q256A83E1241F by Micron Technology Inc

Results Overview of N25Q256A83E1241F by Micron Technology Inc

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N25Q256A83E1241F Information

N25Q256A83E1241F by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for N25Q256A83E1241F

Part # Distributor Description Stock Price Buy
DISTI # N25Q256A83E1241F
Avnet Americas NOR Flash Serial-SPI 3.3V 256Mbit 256M/128M/64M X 1bit/2bit/4bit 7ns/8ns 24-Pin TPBGA T/R - Tape and... Reel (Alt: N25Q256A83E1241F) more RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Reel 0
RFQ
DISTI # N25Q256A83E1241F
Avnet Silica NOR Flash SerialSPI 33V 256Mbit 256M128M64M X 1bit2bit4bit 7ns8ns 24Pin TPBGA TR (Alt: N25Q256A83E12... 41F) more RoHS: Compliant Min Qty: 1122 Package Multiple: 1122 Lead time: 13 Weeks, 0 Days Silica - 0
Buy Now
DISTI # N25Q256A83E1241F
EBV Elektronik NOR Flash SerialSPI 33V 256Mbit 256M128M64M X 1bit2bit4bit 7ns8ns 24Pin TPBGA TR (Alt: N25Q256A83E12... 41F) more RoHS: Compliant Min Qty: 1122 Package Multiple: 1122 EBV - 0
Buy Now

Part Details for N25Q256A83E1241F

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N25Q256A83E1241F Part Data Attributes

N25Q256A83E1241F Micron Technology Inc
Buy Now Datasheet
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N25Q256A83E1241F Micron Technology Inc Flash, 256MX1, PBGA24, TBGA-24
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Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description TBGA-24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Factory Lead Time 18 Weeks
Samacsys Manufacturer Micron
Clock Frequency-Max (fCLK) 108 MHz
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 268435456 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Serial Bus Type QSPI
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

N25Q256A83E1241F Related Parts

N25Q256A83E1241F Frequently Asked Questions (FAQ)

  • The N25Q256A83E1241F supports up to 100,000 erase cycles.

  • The N25Q256A83E1241F uses a volatile lock mechanism to lock pages and blocks. The lock status is lost when power is cycled.

  • Micron recommends using an external POR circuit to ensure a clean power-on reset. The device should be powered up in the following sequence: VCC, then VPP, then CE#.

  • The N25Q256A83E1241F uses a pipelined architecture to allow simultaneous read and write operations. However, the device can only perform one operation at a time per bank.

  • Micron recommends using a periodic refresh mechanism to maintain data integrity. The device should be refreshed every 10 years to maintain data retention.