Part Details for N04L163WC1AB1-70I by NanoAmp Solutions, Inc.
Overview of N04L163WC1AB1-70I by NanoAmp Solutions, Inc.
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for N04L163WC1AB1-70I
N04L163WC1AB1-70I CAD Models
N04L163WC1AB1-70I Part Data Attributes
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N04L163WC1AB1-70I
NanoAmp Solutions, Inc.
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Datasheet
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N04L163WC1AB1-70I
NanoAmp Solutions, Inc.
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | NANOAMP SOLUTIONS INC | |
Package Description | FBGA, BGA48,6X8,30 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B48 | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Number of Terminals | 48 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00001 A | |
Standby Voltage-Min | 1.8 V | |
Supply Current-Max | 0.016 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM |