Part Details for MTA4ATF25664HZ-2G6B1 by Micron Technology Inc
Overview of MTA4ATF25664HZ-2G6B1 by Micron Technology Inc
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Part Details for MTA4ATF25664HZ-2G6B1
MTA4ATF25664HZ-2G6B1 CAD Models
MTA4ATF25664HZ-2G6B1 Part Data Attributes:
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MTA4ATF25664HZ-2G6B1
Micron Technology Inc
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MTA4ATF25664HZ-2G6B1
Micron Technology Inc
DDR DRAM Module, 256MX64, CMOS, HALOGEN FREE, SODIMM-260
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | DIMM, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
| JESD-30 Code | R-XZMA-N260 | |
| Length | 69.6 mm | |
| Memory Density | 17179869184 bit | |
| Memory IC Type | DDR DRAM MODULE | |
| Memory Width | 64 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX64 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 30.13 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.26 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Position | ZIG-ZAG | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 2.5 mm |