Part Details for MT61K512M32KPA-16:B by Micron Technology Inc
Overview of MT61K512M32KPA-16:B by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MT61K512M32KPA-16:B
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MT61K512M32KPA-16:B-ND
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DigiKey | IC DRAM 16GBIT PAR 8GHZ 180FBGA Min Qty: 1260 Lead time: 6 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
MT61K512M32KPA-16:B
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Avnet Americas | DRAM Chip GDDR6 SGRAM 16Gbit 512M X 32 1.35V 180-Pin FBGA - Trays (Alt: MT61K512M32KPA-16:B) RoHS: Compliant Min Qty: 1260 Package Multiple: 1260 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for MT61K512M32KPA-16:B
MT61K512M32KPA-16:B CAD Models
MT61K512M32KPA-16:B Part Data Attributes
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MT61K512M32KPA-16:B
Micron Technology Inc
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Datasheet
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MT61K512M32KPA-16:B
Micron Technology Inc
Synchronous Graphics RAM,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 18 Weeks | |
| Date Of Intro | 2019-02-26 | |
| Samacsys Manufacturer | Micron | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; ALSO OPERATES AT 1.35 V | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B180 | |
| Length | 14 mm | |
| Memory Density | 17179869184 bit | |
| Memory IC Type | GDDR6 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 180 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 512MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA180,14X18,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.2875 V | |
| Supply Voltage-Min (Vsup) | 1.2125 V | |
| Supply Voltage-Nom (Vsup) | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm |