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Overview of MT5C1008EC55L883C by Micron Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for MT5C1008EC55L883C by Micron Technology Inc
Part Data Attributes for MT5C1008EC55L883C by Micron Technology Inc
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|---|---|
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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MICRON TECHNOLOGY INC
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Reach Compliance Code
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not_compliant
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ECCN Code
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3A001.A.2.C
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HTS Code
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8542.32.00.41
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Access Time-Max
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55 ns
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I/O Type
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COMMON
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JESD-30 Code
|
R-XDSO-N32
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JESD-609 Code
|
e0
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Memory Density
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1048576 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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8
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Number of Terminals
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32
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Number of Words
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131072 words
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Number of Words Code
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128000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
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128KX8
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC
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Package Code
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SON
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Package Equivalence Code
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SOLCC32,.4
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Screening Level
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38535Q/M;38534H;883B
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Standby Current-Max
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0.001 A
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Standby Voltage-Min
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2 V
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Supply Current-Max
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0.115 mA
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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NO LEAD
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Terminal Pitch
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1.27 mm
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Terminal Position
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DUAL
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