Part Details for MT55L256L18F1F-12 by Micron Technology Inc
Overview of MT55L256L18F1F-12 by Micron Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Entertainment and Gaming
Part Details for MT55L256L18F1F-12
MT55L256L18F1F-12 CAD Models
MT55L256L18F1F-12 Part Data Attributes
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MT55L256L18F1F-12
Micron Technology Inc
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Datasheet
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MT55L256L18F1F-12
Micron Technology Inc
ZBT SRAM, 256KX18, 9ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 9 ns | |
| Additional Feature | FLOW-THROUGH ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 83 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.25 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for MT55L256L18F1F-12
This table gives cross-reference parts and alternative options found for MT55L256L18F1F-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT55L256L18F1F-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT55L256L18F1F-12 | ZBT SRAM, 256KX18, 9ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | MT55L256L18F1F-12 vs MT55L256L18F1F-12 |