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Part Details for MT53D1024M32D4DT-046AAT:D by Micron Technology Inc
Results Overview of MT53D1024M32D4DT-046AAT:D by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MT53D1024M32D4DT-046AAT:D Information
MT53D1024M32D4DT-046AAT:D by Micron Technology Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for MT53D1024M32D4DT-046AAT:D
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Quest Components | LPDDR4 DRAM, 1GX32, CMOS, PBGA200 | 16 |
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$29.1200 | Buy Now |
|
|
Vyrian | Memory ICs | 466 |
|
RFQ |
Part Details for MT53D1024M32D4DT-046AAT:D
MT53D1024M32D4DT-046AAT:D CAD Models
MT53D1024M32D4DT-046AAT:D Part Data Attributes
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MT53D1024M32D4DT-046AAT:D
Micron Technology Inc
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Datasheet
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MT53D1024M32D4DT-046AAT:D
Micron Technology Inc
DDR DRAM, 1GX32, CMOS, FBGA
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | FBGA-200 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2019-11-26 | |
| Samacsys Manufacturer | Micron | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 2136.7 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 34359738368 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 1073741824 words | |
| Number of Words Code | 1000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1GX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.95 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |